Material / Spare Parts
Encapsulation / Underfill Material
Product Description
- BGA / CSP / Flip Chip Underfill (Material)
- ACP / NCP / Epoxy Adhesive and Encapsulant (Material)
- UV-Cured Adhesive and Encapsulant (Material)
Semicon / PCBA / PCA's Anti-Static Magazine, Carts, ESD Clothes, Wrist Strap
Product Description
- IC Leadframe Baking / Non Baking Magazine
- ESD PCB Plates conveying cart / SMT, PCB Anti-static magazine rack
- ESD Clothes / ESD wrist, Foot band, Grounding cord
Dicing Blade
Product Description
- Dicing Blade consumable parts
Semicon Spindle Repair Services
Product Description
- Semicon Spindle repair services for air and ball bearing spindles
Thermaplate (ESD,High Temp.)
Product Description
Bakelite / ESD-Bakelite
Product Description
- In circuit test (ICT) & automatic test equipment (ATE)
Acrylic / ESD-Acrylic
Product Description
Probe
Product Description
